南方科技大学是由中国广东省领导和管理、深圳市举全市之力创建的一所公办创新型大学,目标是迅速建成国际化高水平研究型大学,建成中国重大科学技术研究与拔尖创新人才培养的重要基地……

南方科技大学以学分制、导师制、书院制为基础,以人才培养的个性化、小班化、国际化为特色,通过为一流的人才培养体系,培养人格健全、基础扎实、能力突出、具有国际视野、社会责任感、创新精神和实践能力的高素质人才。

南科大已初步建成国际交流的平台,与国际知名大学在人才培养、教学科研等方面达成合作协议,为学生开展境外交流学习。同时,学校积极与内地的多个机构开展全方位合作。

南方科技大学本科招生采用基于高考的综合评价录取模式,即高考成绩占60%,我校自主组织的能力测试成绩占30%(其中面谈成绩为5%),高中学业水平考试成绩占10%,按考生“631”综合成绩排名从高到低录取。综合评价录取模式由我校在2012年率先实施。

南科大教育基金会由理事会、监事会、秘书处组成。理事会是基金会的最高权力机构;监事会负责检查财务和会计资料,监督理事会遵守法律和章程的情况;秘书处是基金会常设办事机构,在理事会领导下负责基金会的日常工作。

学校党委切实履行党建工作职责,不断强化班子建设和基层党组织建设,充分发挥好党委对学校各项工作的核心统领作用和各党支部的战斗堡垒作用,切实开展组织统战和党风廉政建设各项工作。学校高度重视群团组织建设,充分调动全体师生员工积极性,维护教职工的合法权益,推进学校民主管理,促进学校健康发展,全力营造齐心协力、团结向上、奋发有为的干事创业氛围。

书院导师

首页 > 学生生活 > 致仁书院 > 书院导师 > 吴勇波

师资队伍

吴勇波


讲席教授

机械与能源工程系

0755- 88018156

创园7栋502

wuyb@sustc.edu.cn

讲座教授  博士生导师

研究方向:多场(超声、磁流变、等离子体氧化、固相化学反应、电致塑性效应)辅助精密超精密加工。
E-mail:
wuyb@sustc.edu.cn

吴勇波,1997年获得东北大学(日本)博士学位,回国前任日本秋田县立大学终身正教授,国际磨粒技术委员会委员、国际纳米制造学会会士、 国际微纳机械加工制造学术研讨会ISMNM系列组委会主席。在精密加工制造领域开展了多年卓越的科研教学工作,率先在国际上提出多场辅助精密加工概念,并开展了一系列前瞻性的原创性研究。发表高水平论文200多篇,日本专利16项,中国专利8项,参与撰写英日文著作5部,先后承担项目40余项,获得超3亿日元的研究经费。接受与培养访问研究员、博士生、硕士生60余人。

研究领域:

 超声辅助机械加工工艺与设备
◆ 磁场利用研抛精密加工工艺与设备
 温度场辅助高效加工工艺与设备
 固相化学反应利用/超声辅助复合加工工艺与设备

学习经历:

◆ 1978.10 - 1982.07:合肥工业大学 ,机械制造工程,学士
◆ 1982.09 - 1985.02 :北京航空航天大学,航空制造工程,硕士
◆ 1992.04 - 1997.03 :东北大学(日本),精密工学工程,博士

工作经历:

◆ 2017.05 - 现在   南方科技大学,讲座教授
 2007.04 - 2017.04  秋田县立大学 教授,研究室主任
 2004.04 - 2007.03  秋田县立大学,副教授
◆ 2000.04 - 2004.03  秋田县立大学,专任讲师
 1998.07 - 2000.03  东北大学(日本),研究助理教授
 1997.04 - 1998.06  尼康公司,高级工程师
◆ 1991.10 - 1992.03  东北大学(日本),客座研究员
◆ 1989.06 - 1991.09  南昌航空大学,讲师
 1987.10 - 1989.05   丰桥技术科学大学,客座研究员
◆ 1985.03 - 1987.09   南昌航空大学,助教

所获荣誉:
◆ 2018年入选深圳市南山区“领航人才”A类
◆ 2017年入选深圳市海外高层次人才“孔雀人才”A类
◆ 2012,Fellow, International Society of NanoManufacturing (ISNM)
◆ 2013,Representative, Japan Society for Precision Engineering (JSPE)
◆ 2012, Advisor/Supervisor of outstanding young scholar Award Winnerat 12theuspen,Stockholm, Sweden,
◆ 2013,Advisor/Supervisor of best paper Award Winner at 8th LEM21, Matsushima, Japan
◆ 2014,Advisor/Supervisor of outstanding young scholar Award Winner at 14theuspen, Dubrovnik, Croatia,
◆ 2015,Advisor of best paper Award winner at 11th CJUMP, Itabashi, Tokyo, Japan
◆ 2011年江西省“赣鄱英才555工程”第一批入选者
◆ 2009,30th Machine Tools Technology Award, Japanese Machine Tools Technology Promotion Foundation
◆ 2004,Best Paper Award of JSAT (Japan Society for Abrasive Technology)
◆ 2002,Kumagai Award of JSPE (Japan Society for Precision Engineering)
◆ 1999,Manufacturing and Machine Tool Research Award of JSME (Japan Society of Mechanical Engineers)

代表性学术论文:
1. Y. Wu*, Q. Wang, S. Li, D. Lu, Ultrasonic Assisted Machining of Nickle-based Superalloy Inconel 718, in: Superalloys, In Tech Publishers, ISBN 978-953-51-5335-1, Croatia-EU, 2018.3.1.
2. S. Li, Y. Wu*, M. Nomura, T. Fujii, Proposal of an ultrasonic assisted electrochemical grinding method and its fundamental machining characteristics in the grinding of Ti–6Al–4V, ASME Journal of Manufacturing Science and Engineering, 140 (2018) 071009-1-9.
3. W. Xu* and Y. Wu*, A novel approach to fabricate high aspect ratio micro-rod using ultrasonic vibration-assisted centreless grinding,International Journal of Mechanical Sciences, 141 (2018) 21-30.
4. Q. Wang, Y. Wu*, T. Bitou, M. Nomura, T. Fujii, Proposal of a tilted helical milling technique for high quality hole drilling of CFRP: Kinetic analysis of hole formation and material removal, International Journal of Advanced Manufacturing Technology, 94 (2018)4221-4235,DOI 10.1007/s00170-017-1106-3
5. S. Li, Y. Wu*, K. Yamamura, M. Nomura, T. Fujii, Improving the grindability of titanium alloy Ti-6Al-4V with the assistance of ultrasonic vibration and plasma electrolytic oxidation, CIRP Annals Manufacturing Technology, Vol.66, Issue 1 (2017) DOI: 10.1016/j.cirp.2017.04.089
6. Y. Wu*, S. Li, M. Nomura, S. Kobayashi, T. Tachibana, Ultrasonic assisted electrolytic grinding of titanium alloy Ti-6Al-4V,International Journal of Nanomanufacturing, Vol.13, Issue 2( 2017) 152-160.
7. S. Li, Y. Wu*, M. Nomura, Effect of grinding wheel ultrasonic vibration on chip formation in surface grinding of Inconel 718, Int. J. of Advanced Manufacturing Technology, 2016; DOI: 10.1007/s00170-015-8149-0.
8. Y. Wang, Y. Wu* and M. Nomura, Feasibility study on surface finishing of miniature V-grooves with magnetic compound fluid slurry, Precision Engineering, Vol.45, (2016) pp.67-78.
9. S. Li, Y. Wu*, M. Nomura, Improving the working surface condition of electroplated cBN grinding quill in surface grinding of Inconel 718 by the assistance of ultrasonic vibration, ASME J. of Manufacturing Science and Engineering, Vol.138, (2016) pp.071008-1_8.
10. D. Lu, Q. Wang, Y. Wu*, J. Cao, H. Guo, Fundamental Turning Characteristics of Inconel 718 by Applying Ultrasonic Elliptical Vibration on the Base Plane, Materials and Manufacturing Processes, Vol.30, No.8 (2015) pp.1010-1017.
11. J. Cao, Y. Wu*, J. Li, Q. Zhang, A grinding force model for ultrasonic assisted internal grinding (UAIG) of SiC ceramics, Int. J. of Advanced Manufacturing Technology, Vol.81, No.5 (2015) pp.875-885.
12. Y. Wang, Y. Wu*, H. Guo, M. Fujimoto, M. Nomura and K. Shimada, A New MCF (Magnetic Compound Fluid) Slurry and its Performance in Magnetic Field-assisted Polishing of Oxygen- free Copper, J. of Applied Physics, 117 (2015) pp.17D712-1_4.
13. H. Guo, Y. Wu*, D. Lu, M. Fujimoto, M. Nomura, Effects of pressure and shear stress on material removal rate in ultra-fine polishing of optical glass with magnetic compound fluid slurry, J. of Materials Processing Technology, Vol.214, No.11 (2014) pp.2759-2769.
14. J. Cao, Y. Wu*, D. Lu, M. Fujimoto, M. Nomura, Material removal behavior in ultrasonic- assisted scratching of SiC ceramics with a single diamond tool, Int. J. of Machine Tools and Manufacture, Vol. 79 (2014) pp.49-61.
15. Y. Li, Y. Wu*, L. Zhou, M. Fujimoto, Vibration-Assisted Dry Polishing of Fused Silica Using a Fixed-Abrasive Polisher, Int. J. of Machine Tools and Manufacture, Vol. 77, No.1 (2014) pp.93- 102.
16. L. Jiao, Y. Wu*, X. Wang, H. Guo, Z. Liang, Fundamental performance of magnetic compound fluid (MCF) wheel in ultra-fine surface finishing of optical glass, Int. J. of Machine Tools and Manufacture, Vol. 75 (2013) pp.109-118.
17. Z. Liang, X. Wang, Y. Wu, L. Xie, L. Jiao, W. Zhao, Experimental Study on Brittle - Ductile Transition in Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire using Single Diamond Abrasive Grain, Int. J. of Machine Tools and Manufacture, Vol. 71, (2013) pp.41-51.
18. Y. Wu* and H. Guo, “Polishing Mechanism and Applications of Magnetic Compound Fluid (MCF) Slurry”, in: Manufacturing Technologies for the Performance Enhancement of Optical Glasses, Chapter 4.5, Science and Technology Publications, Tokyo, Japan, 2012.
19. W. Xu, Y. Wu*, Simulation investigation of through-feed centerless grinding process performed on a surface grinder, Journal of Materials Processing Technology, Vol. 212 (2012), pp.927-935.
20. Y. Li, Y. Wu*, J. Wang, W. Yang, Y. Guo and Q. Xu, Tentative investigation towards precision polishing of optical components with ultrasonically vibrating bound-abrasive pellets, Optics Express, Vol.20, No.1 (2012), pp.568-575.
21. Y. Wu*, Y. Li, J. Cao and Z. Liang, “Ultrasonic Assisted Fixed Abrasive Machining of Hard- Brittle Materials”, in: Ultrasonics: Theory, Techniques and Practical Application, NOVA SCIENCE PUBLISHERS, INC., NY, USA, 2012.
22. Y. Peng, Y. Wu*, Z.Q. Liang, Y. B. Guo and X. Lin, An Experimental Study of Ultrasonic Vibration-assisted Grinding of Polysilicon Using Two-Dimensional Vertical Workpiece Vibration, Int. J. of Advanced Manufacturing Technology, Vol.54, (2011) pp.941-947.
23. W. Xu and Y. Wu*, A new in-feed centerless grinding technique using a surface grinder J. of materials Processing Technology, Vol.211, (2011) pp.141-149.
24. Z. Liang, Y. Wu*, X. Wang, W. Zhao, T. Sato, W. Lin, A New Two-dimensional Ultrasonic Assisted Grinding (2D-UAG) Method and Its Fundamental Performance in Monocrystal Silicon Machining, Int. J. of Machine Tools and Manufacture, Vol.50, (2010) pp.728-736.
25. W. Xu, Y. Wu*, T. Sato, W. Lin, Effects of process parameters on workpiece roundness in tangential-feed centerless grinding using a surface grinder, J. of Materials Processing Technology, Vol.210, (2010) pp.759-766.
26. Y. Wu*, S. Yokoyama, T. Sato, W. Lin, T. Tachibana, Development of a new rotary ultrasonic spindle for precision ultrasonically assisted grinding, Int. J. of Machine Tools and Manufacture, Vol.49, No.12/13, (2009) pp.933-938.
27. T. Furuya, Y. Wu*, M. Nomura, Y. Shimada and K. Yamamoto, Fundamental performance of magnetic compound fluid polishing liquid in contact-free polishing of metal surface, J. of Materials Processing Technology, Vol. 201, (2008) pp.536-541.
28. Y. Wu*, “Ultrasonic-shoe Centerless Grinding”, in: Illustration of Abrasive Technology, Chapter 2.2.4, edited by Japan Society for Abrasive Technology, Nihon Kogyo Chosakai Publications, Tokyo, Japan, 2005.
29. Y. Wu*, “Ultra-precision Centerless Grinding”, in: Ultra-precision Machining and Aspherical Machining, Chapter 1.7, edited by Katsuo Syoji, NTS Publications, Tokyo, Japan, 2004.
© 2015 All Rights Reserved. 粤ICP备14051456号 地址:广东省深圳市南山区学苑大道1088号 电话:+86-755-8801 0000 邮编:518055
*为必填项